ISP CO., LTD
ENKO
Request a quote

Products

In-Line Solution Analyzer

Fully automated in-line XRF measurement systems built into the production line — wafer, MLCC, battery, display, connector and PCB.

iEDX-750T (Wafer)

Automated XRF for Wafer Plating Control

iEDX-750T (Wafer) — In-Line Solution Analyzer
iEDX-750T (Wafer) — In-Line Solution Analyzer
iEDX-750T (Wafer) — In-Line Solution Analyzer

Research data

Tantalum thickness measurement run 22 specimens — XRF intensity vs. reference thickness View Hide
ItemTa(nm)Tabr (Lb Intensity)Ta(nm) Conversion(1)Ta(nm) Conversion(2)
Specimen115506.613.3
Specimen215512.113.6
Specimen315439.5714.7
Specimen415421.516.6
Specimen515336.9715.1
Specimen615298.4314.4
Specimen720605.219.7
Specimen820534.517.8
Specimen920478.717.6
Specimen1020422.9316.7
Specimen1120369.0717.8
Specimen122033718.0
Specimen1350871.8749.2
Specimen1450970.3348.8
Specimen1550785.9350.4
Specimen1650700.848.7
Specimen1750585.1746.2
Specimen185050635.9
Specimen1915590.73–
Specimen2020655.7–
Specimen21501080.87–
Specimen220368.03–
iEDX-750T (Wafer) detailiEDX-750T (Wafer) detail

Video

Enquire about iEDX-750T (Wafer)

iEDX-750T (MLCC)

Auto XRF – MLCC Thin Film Plating Thickness Measurement

iEDX-750T (MLCC) — In-Line Solution Analyzer
iEDX-750T (MLCC) — In-Line Solution Analyzer

Specifications

X-ray tubeMicrofocus 50kV (1kV Step), 1mA, Mo Target
X-ray detectorSDD (Silicon Drift Detector) FWHM 125eV @Mn Ka, Window : Be 1mil
CollimatorCapillary Spot Size 30um
Vision Camera
  • AL6061, white anodizing, 100Φ x 600mm
  • Roundness ±20um, Concentricity ±20um
  • Ra 0.6s
Max Measurement Speed50M / min
Motorized Stage
  • Stroke : X 690, Y 290, Z1 30, Z2 60, Cam 280mm
  • Repeatability ±10um, Accuracy ±20um
Straightness of the stone plateFlatness ±10um, Straightness ±10um
Gravure Pattern Size220, 330, 440 mm
Radiation safety< 1uSv/h at any point on the instrument surface
Dimensions1370(W) x 700(D) x 1650(H) mm
WeightAbout 800 kg
Power3-Phase 220VAC ± 10%, 60Hz, 10A
iEDX-750T (MLCC) detailiEDX-750T (MLCC) detailiEDX-750T (MLCC) detail

Video

Enquire about iEDX-750T (MLCC)

iEDX-830T (Battery)

Inline Battery Plating Thickness Analyzer

iEDX-830T (Battery) — In-Line Solution Analyzer
iEDX-830T (Battery) — In-Line Solution Analyzer
iEDX-830T (Battery) — In-Line Solution Analyzer

General

Product Name iEDX-830T (Automatic measurement system for measuring fuel cell printing Pt thickness)
Composition Measurement of battery platinum (Pt) plating thickness (anode and cathode materials)

Enquire about iEDX-830T (Battery)

iEDX-850T (Display)

Inline INVAR Display Thickness Analyzer

iEDX-850T (Display) — In-Line Solution Analyzer
iEDX-850T (Display) — In-Line Solution Analyzer
iEDX-850T (Display) — In-Line Solution Analyzer

General

Product Name iEDX-850T (Automatic measurement system for measuring display INVAR)
Composition Measurement of OLED film plating thickness

Specifications

X-Ray PipeMo Target, 50kVp, 1mA
X-ray DetectorF-SDD
Collimator0.5mm / 1mm / 1.5mm
Detection ElementPlating: Ti(22) ~ U(92)
Sample typeOLED Film
Equipment Size (WxDxH)2500 x 3600 x 2400 mm
CCD X2448 x 2048 (5 megapixel)
Safety3-point safety device
Report TypeExcel, PDF
Main applicationInvar (Fe+Ni) / Glass

Enquire about iEDX-850T (Display)

iEDX-750T (Connector)

Inline Connector Plating Thickness Analyzer

iEDX-750T (Connector) — In-Line Solution Analyzer
iEDX-750T (Connector) — In-Line Solution Analyzer
iEDX-750T (Connector) — In-Line Solution Analyzer

Enquire about iEDX-750T (Connector)

iEDX-750T (PCB)

Inline PCB Plating Thickness Analyzer

iEDX-750T (PCB) — In-Line Solution Analyzer
iEDX-750T (PCB) — In-Line Solution Analyzer
iEDX-750T (PCB) — In-Line Solution Analyzer
iEDX-750T (PCB) — In-Line Solution Analyzer
iEDX-750T (PCB) — In-Line Solution Analyzer
iEDX-750T (PCB) — In-Line Solution Analyzer

General

Product Name Automatic gauge for measuring plating thickness
Model Name iEDX-750T
User Surface treatment of PCB, PKG, and FPCB

Recommended Industry Type

  • PCB
  • PKG
  • FPCB

Application

Surface treatment of PCB, PKG, and FPCB

  • Single-layer, multi-layer, and alloy plating thickness measurement

Plating layers

  • Au/Ni
  • Sn/Ni
  • Ag/Ni
  • Au/Pd/Ni
  • Cr/Fe
  • ENIG
  • ENEPIG

Specifications

X-Ray PipeMo Target, 50kVp, 1mA
X-ray DetectorF-SDD
Poly CapillaryFocus size: 30㎛ / 15㎛
Detection ElementPlating: Ti(22) ~ U(92)
Sample TypeWide PCB
Size (WxDxH)
  • Equipment: 2600 x 1350 x 2050mm
  • PCB Size: 415x510 / 610x510 / 810x610mm
CCD X2448 x 2048 (5 megapixel)
Report TypeExcel, PDF
Main applicationAu/Ni/Cu, Au/Pd/Ni/Cu (gold, nickel, copper, palladium plating layer)

Video

Enquire about iEDX-750T (PCB)

iEDX-100L

Online Liquid Analyzer

iEDX-100L — In-Line Solution Analyzer

Video

Enquire about iEDX-100L

iTG-1000A

Automated Copper Plating Thickness Analyzer

iTG-1000A — In-Line Solution Analyzer
iTG-1000A — In-Line Solution Analyzer

General

Product Name Automatic copper plating thickness gauge
Model Name iTG-1000A (RS surface resistance measurement)
Use PCB, FPCB, and PKG copper plating thickness measurement
User
  • Manufacturers requiring PCB copper plating thickness measurement
  • Copper plating thickness measurement before and after half etching

Recommended Industry Type

  • PCB
  • PKG
  • FPCB

Application

Measurement range

  • Chemical copper plating thickness measurement (0.1um~2um)
  • Electroplating thickness measurement (2um~100um)

Measurement method

  • Automatic measurement by lot

Specifications

DescriptioniTG-1000A
Measurement Type4Pin probe Electrical Resistance Method
Measurable SampleCopper layer on PCB
Measurement RangeRange 1 : 0.1~2um / Range 2 : 2~100um
Accuracy±1~3% under with reference to standards
Measurement Time1 sec/point
Size (WxDxH)Varies depending on product type and specifications
SoftwareAuto Measure Program
Test reportPDF, Excel etc
Probe Life Time50,000 Time
iTG-1000A detailiTG-1000A detailiTG-1000A detailiTG-1000A detail

Video

Enquire about iTG-1000A