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제품정보

Automatic In-Line 측정분석기

웨이퍼, MLCC, 배터리, 디스플레이, 커넥터, PCB 생산라인에 통합되는 완전 자동 인라인 XRF 측정 시스템입니다.

iEDX-750T (Wafer)

Wafer Metal 두께 자동측정시스템

iEDX-750T (Wafer) — Automatic In-Line 측정분석기
iEDX-750T (Wafer) — Automatic In-Line 측정분석기
iEDX-750T (Wafer) — Automatic In-Line 측정분석기

연구자료

Tantalum thickness measurement run 22 specimens — XRF intensity vs. reference thickness View Hide
ItemTa(nm)Tabr (Lb Intensity)Ta(nm) Conversion(1)Ta(nm) Conversion(2)
Specimen115506.613.3
Specimen215512.113.6
Specimen315439.5714.7
Specimen415421.516.6
Specimen515336.9715.1
Specimen615298.4314.4
Specimen720605.219.7
Specimen820534.517.8
Specimen920478.717.6
Specimen1020422.9316.7
Specimen1120369.0717.8
Specimen122033718.0
Specimen1350871.8749.2
Specimen1450970.3348.8
Specimen1550785.9350.4
Specimen1650700.848.7
Specimen1750585.1746.2
Specimen185050635.9
Specimen1915590.73–
Specimen2020655.7–
Specimen21501080.87–
Specimen220368.03–
iEDX-750T (Wafer) detailiEDX-750T (Wafer) detail

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iEDX-750T (MLCC)

MLCC 그라비아 인쇄공정 인라인 Ni 두께 자동 측정시스템

iEDX-750T (MLCC) — Automatic In-Line 측정분석기
iEDX-750T (MLCC) — Automatic In-Line 측정분석기

제품사양

X-ray tubeMicrofocus 50kV (1kV Step), 1mA, Mo Target
X-ray detectorSDD (Silicon Drift Detector) FWHM 125eV @Mn Ka, Window : Be 1mil
CollimatorCapillary Spot Size 30um
Vision Camera
  • AL6061, white anodizing, 100Φ x 600mm
  • Roundness ±20um, Concentricity ±20um
  • Ra 0.6s
Max Measurement Speed50M / min
Motorized Stage
  • Stroke : X 690, Y 290, Z1 30, Z2 60, Cam 280mm
  • Repeatability ±10um, Accuracy ±20um
Straightness of the stone plateFlatness ±10um, Straightness ±10um
Gravure Pattern Size220, 330, 440 mm
Radiation safety< 1uSv/h at any point on the instrument surface
Dimensions1370(W) x 700(D) x 1650(H) mm
WeightAbout 800 kg
Power3-Phase 220VAC ± 10%, 60Hz, 10A
iEDX-750T (MLCC) detailiEDX-750T (MLCC) detailiEDX-750T (MLCC) detail

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iEDX-830T (Battery)

연료전지 인쇄 Pt 두께 자동 측정시스템

iEDX-830T (Battery) — Automatic In-Line 측정분석기
iEDX-830T (Battery) — Automatic In-Line 측정분석기
iEDX-830T (Battery) — Automatic In-Line 측정분석기

일반

Product Name iEDX-830T (Automatic measurement system for measuring fuel cell printing Pt thickness)
Composition Measurement of battery platinum (Pt) plating thickness (anode and cathode materials)

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iEDX-850T (Display)

디스플레이 INVAR 자동 측정시스템

iEDX-850T (Display) — Automatic In-Line 측정분석기
iEDX-850T (Display) — Automatic In-Line 측정분석기
iEDX-850T (Display) — Automatic In-Line 측정분석기

일반

Product Name iEDX-850T (Automatic measurement system for measuring display INVAR)
Composition Measurement of OLED film plating thickness

제품사양

X-Ray PipeMo Target, 50kVp, 1mA
X-ray DetectorF-SDD
Collimator0.5mm / 1mm / 1.5mm
Detection ElementPlating: Ti(22) ~ U(92)
Sample typeOLED Film
Equipment Size (WxDxH)2500 x 3600 x 2400 mm
CCD X2448 x 2048 (5 megapixel)
Safety3-point safety device
Report TypeExcel, PDF
Main applicationInvar (Fe+Ni) / Glass

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iEDX-750T (Connector)

커넥터 도금 두께 자동측정시스템

iEDX-750T (Connector) — Automatic In-Line 측정분석기
iEDX-750T (Connector) — Automatic In-Line 측정분석기
iEDX-750T (Connector) — Automatic In-Line 측정분석기

iEDX-750T (Connector) 문의하기

iEDX-750T (PCB)

PCB 도금 두께 자동측정시스템

iEDX-750T (PCB) — Automatic In-Line 측정분석기
iEDX-750T (PCB) — Automatic In-Line 측정분석기
iEDX-750T (PCB) — Automatic In-Line 측정분석기
iEDX-750T (PCB) — Automatic In-Line 측정분석기
iEDX-750T (PCB) — Automatic In-Line 측정분석기
iEDX-750T (PCB) — Automatic In-Line 측정분석기

일반

Product Name Automatic gauge for measuring plating thickness
Model Name iEDX-750T
User Surface treatment of PCB, PKG, and FPCB

추천업종

  • PCB
  • PKG
  • FPCB

응용분야

Surface treatment of PCB, PKG, and FPCB

  • Single-layer, multi-layer, and alloy plating thickness measurement

Plating layers

  • Au/Ni
  • Sn/Ni
  • Ag/Ni
  • Au/Pd/Ni
  • Cr/Fe
  • ENIG
  • ENEPIG

제품사양

X-Ray PipeMo Target, 50kVp, 1mA
X-ray DetectorF-SDD
Poly CapillaryFocus size: 30㎛ / 15㎛
Detection ElementPlating: Ti(22) ~ U(92)
Sample TypeWide PCB
Size (WxDxH)
  • Equipment: 2600 x 1350 x 2050mm
  • PCB Size: 415x510 / 610x510 / 810x610mm
CCD X2448 x 2048 (5 megapixel)
Report TypeExcel, PDF
Main applicationAu/Ni/Cu, Au/Pd/Ni/Cu (gold, nickel, copper, palladium plating layer)

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iEDX-100L

도금용액 농도분석 인라인시스템

iEDX-100L — Automatic In-Line 측정분석기

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iTG-1000A

동도금 두께 자동측정기

iTG-1000A — Automatic In-Line 측정분석기
iTG-1000A — Automatic In-Line 측정분석기

일반

Product Name Automatic copper plating thickness gauge
Model Name iTG-1000A (RS surface resistance measurement)
Use PCB, FPCB, and PKG copper plating thickness measurement
User
  • Manufacturers requiring PCB copper plating thickness measurement
  • Copper plating thickness measurement before and after half etching

추천업종

  • PCB
  • PKG
  • FPCB

응용분야

Measurement range

  • Chemical copper plating thickness measurement (0.1um~2um)
  • Electroplating thickness measurement (2um~100um)

Measurement method

  • Automatic measurement by lot

제품사양

DescriptioniTG-1000A
Measurement Type4Pin probe Electrical Resistance Method
Measurable SampleCopper layer on PCB
Measurement RangeRange 1 : 0.1~2um / Range 2 : 2~100um
Accuracy±1~3% under with reference to standards
Measurement Time1 sec/point
Size (WxDxH)Varies depending on product type and specifications
SoftwareAuto Measure Program
Test reportPDF, Excel etc
Probe Life Time50,000 Time
iTG-1000A detailiTG-1000A detailiTG-1000A detailiTG-1000A detail

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