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Plating Thickness Analyzer

Multilayer thin-film plating thickness gauges and copper plating thickness gauges for surface-treatment, PCB and connector production.

iEDX-150T Series

Plating Thickness Analyzer

iEDX-150T Series — Plating Thickness Analyzer
iEDX-150T Series — Plating Thickness Analyzer
iEDX-150T Series — Plating Thickness Analyzer
iEDX-150T Series — Plating Thickness Analyzer

General

Product Name Multilayer Thin Film Plating Thickness Gauge
Model Name
  • iEDX-150T
  • iEDX-150WT
  • iEDX-150uT
  • iEDX-15uWT
User
  • Metal surface treatment
  • Industries requiring plating solution analysis

Recommended Industry Type

  • Automotive
  • Semiconductor
  • Battery
  • Electric and Electronic Products
  • PCB
  • Connector
  • Company-affiliated research institute
  • Government-affiliated research institute
  • University

Application

1. General Surface Treatment

2. PCB Surface Treatment

iEDX-150T Series applicationiEDX-150T Series application

Specifications

Model Name150T150uT150wT150uWT
X-Ray TubeW/Rh/Mo target 50kVp, 1mA
Detection SystemSi Pin (Option : SDD, FSDD)Fast SDDSi Pin (Option : SDD, FSDD)Fast SDD
Collimator0.3mmCapillary Optics Spot 30um (Option : 8, 15um)0.3mmCapillary Optics Spot 30um (Option : 8, 15um)
OptionPlating thickness : 0.05, 0.1, 0.3, 1mm / RoHS: 4mm / Halogen Free: 4mmPlating thickness : 0.05, 0.1, 0.3, 1mm / RoHS: 4mm / Halogen Free: 4mm
Detection ElementPlating : Ti(22)~U(92) / Option – RoHS: Al(13)~U(92)
Sample TypeSolid
Size (WxDxH)Product : 520x770x500, 650x820x600 / Table : 210x210, 310x260 / Travel : 160x160x100, 220x200x150Product : 610x910x360, 815x1100x430 / Table : 310x310, 520x520 / Travel : 310x310x10, 520x520x10
Camera Resolution40~80X
Safety3-point safety device
Report TypeExcel, PDF, user-designated form
OptionStandard specimen
Plating ApplicationAu/Ni/Cu, Au/NiP/Cu, Sn/Cu, Ni/Cu, Sn/Ni/Cu, Ni/Fe, Zn/Fe, ZnNi/Fe, Ni/Cu/Fe, Cu/Fe, Cr/Ni/Fe

Video

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iTG-B Series

iTG-B10 & iTG-B500 | Copper Plating Thickness Gauge (Manual/Semi-Automatic)

iTG-B Series — Plating Thickness Analyzer
iTG-B Series — Plating Thickness Analyzer

General

Product Name
  • Copper plating thickness gauge
  • Semi-automatic copper plating thickness gauge
Model Name
  • iTG-B10 — RS surface resistance measurement
  • iTG-B500 — RS surface resistance measurement
Use
  • PCB copper plating thickness measurement — Table top manual measurement
  • PCB copper plating thickness measurement — Possible pairing of the plating hanger number, possible to configure semi-automatic equipment
User
  • Manufacturers requiring PCB copper plating thickness measurement
  • Copper plating thickness measurement before and after half etching

Recommended Industry Type

  • PCB
  • PKG
  • FPCB

Application

Outer-layer copper thickness analysis

iTG-B Series application

Specifications

DescriptioniTG-B10iTG-B500
Measurement Type4Pin probe Electrical Resistance Method4Pin probe Electrical Resistance Method
Measurable SampleCopper layer on PCBCopper layer on PCB
Measurement RangeRange 1 : 0.1~2um / Range 2 : 2~8um / Range 3 : 5~120umRange 1 : 0.1~2um / Range 2 : 2~8um / Range 3 : 5~120um
Accuracy±1~3% under with reference to standards±1~3% under with reference to standards
Measurement Time1 sec/point1 sec/point
Size (WxDxH)300x200x250mm850x800x1500mm
SoftwareiTG-B10 ProgramiTG-B500 Auto Measure Program
Test reportPDF, Excel etcPDF, Excel etc
Probe Life Time50,000 Time50,000 Time

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